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1361 results for found: 익숙한 Diffusion Furnaces & Accessories

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  • ASM: A 412

    ASM A 412 Vertical Furnace, 8" to 12" (2) A412 Reactor Modules in a single system Four (4) position reactor carousel Cassette stocker carousel (28 cassettes) Each reactor has individual boat in-out lift elevator Dual Reactor with four (4) wafer boats Uninterrupted Operation with 100% utilization, and 50% more productivity than single reactor systems Dual Tube Configuration Side A is Arsenic Doped LPCVD Polysilicon Side B is undoped LPCVD Polysilicon Currently wrapped and stored 2006 vintage.
  • ASM: A 400

    ASM A 400 Furnace Process: HTO/SiN N2, SiH2Cl2, N2O 1998 vintage.
  • ASM: A 400

    ASM: A 400 LPCVD furnace Reactor 1: Poly deposition Reactor 2: Nitride deposition 2003 vintage.
  • ASM: A400

    ASM A400 Wet oxidation system.
  • ASM: A 400

    ASM A 400 Gate / Poly System, 6" 8" Capable 2002 vintage.
  • ASM: A 400

    ASM A 400 Gate / Poly system, 6" 8" Capable 2002 vintage.
  • ASM: A 400

    ASM A 400 Polymide anneal system, 6" 2008 vintage.
  • ASM: A 412

    ASM A 412 LPCVD Vertical Furnace, 8" to 12" 2 ea A412 Reactor Modules in a single system Four (4) position reactor carousel Cassette stocker carousel (28 cassettes) Each reactor has individual boat in-out lift elevator Dual Reactor with four (4) wafer boats Uninterrupted Operation with 100% utilization, and 50% more productivity than single reactor systems Dual Tube Configuration Side A is LPCVD Silicon Nitride Side B is LPCVD Arsenic Doped Poly Currently wrapped and stored 2006 vintage.
  • ASM: A 400

    ASM A 400 Furnace Process: HTO/SiN N2, SiH2Cl2, N2O 1998 vintage.
  • ASM: A 400

    ASM A 400 Furnace, 8" Process: poly and nitride High temp for both LPCVD tubes: <1000°C Prepared for SMIF All gas panels and MFCs are purged with N2 QTZ is removed 2001 vintage.
  • ASM: A 400

    ASM A 400 Furnace, 8" Process: poly and nitride High temp for both LPCVD tubes: <1000°C Prepared for SMIF All gas panels and MFCs are purged with N2 QTZ is removed 2001 vintage.
  • ASM: A 400

    ASM A 400 Oxidation furnace Dual-reactors / dual-boats 8" Tube, 8" / 6" boats Wet + Dry oxidation / boat rotation Nitride and oxide capable Argon / Nitrogen dilution (5) Temperature zones.
  • ASM: DFS-250

    ASM: DFS-250 Diffusion furnace 1. Poly LPCVD 2. Poly LPCVD 3. Nitride LPCVD 4. Nitride LPCVD.
  • ASM: A412

    ASM A412 LPCVD Vertical furnaces, 12" Process: PH3 Doped poly/LPCVD Software version: 6.80C Heater type: MRL Loader configuration, 4 or 5 loader: 4 Quartzware configuration Outer tube: Quartz Inner tube: Quartz Boat: SiC boat Boat fix ring/Cap quartz: Quartz (6) Adiabatic plate (1) SiH4, Type (L-type, Straight, Diffuser, Shower): Multihole, U/D/L (1) O2, Type (L-type, Straight, Diffuser, Shower): Multihole, E (1) PH3, Type (L-type, Straight, Diffuser, Shower): Multihole, U/D/L Vacuum line configuration Design: Original config 10 Torr Baratron model: MKS 10 Torr Baratron full scale setting: 10(F/S) 1000 Torr Baratron model: MKS 1000 Torr Baratron full scale setting: 1000(F/S) ATM sensor model: MKS Vent valve 1 (VV1) normally closed/open,plunger, diaphragm: Normally open,plunger Check valve model: Fujikin Check valve resistance pressure: 2.26 Kpa Mainvalve type, Kitz or CKD: MKS Slow valve, incorporated with mainvalve or separate(AV72,AV77): Separate (PV003) Slow valve orifice size: 2.0mm (PV003) Pressure range of vacuum gauge(Inficon Pirani gauge): 10T Control table Alarm watch/table setting Temp (Low Alarm Limit(deg)/High Alarm Limit(deg)/Check Time(min)) U: 0.7/0.7/30S CU: 0.7/0.7/30S C: 0.7/0.7/30S CL: 0.7/0.7/30S L: 0.7/0.7/30S Pressure (Low Alarm Limit(Torr)/High Alarm Limit(Torr)/Check Time(S)): 0.02/0.02/30S MFC (Low Alarm Limit(%)/High Alarm Limit(%)/Check Time(S)) MFC1: N2: 2%/2%/10sec MFC2: N2: 2%/2%/10sec MFC3: N2: 2%/2%/10sec MFC4: N2: 2%/2%/10sec MFC5 SiH4: 2%/2%/10sec MFC6: SiH4: 2%/2%/10sec MFC7: SiH4: 2%/2%/10sec MFC8: 1%O2/Ar: 1%/1%/10sec MFC9: 5%PH3/N2: 2%/2%/10sec MFC10: 5%PH3/N2: 2%/2%/10sec MFC11: 5%PH3/N2: 2%/2%/10sec MFC12: ClF3: 10%/10%/10sec Transfer table Wafer charge command (charge/discharge) Side dummy (5) Upper (10) Lower (100) Product (5) Monitor (105) Product & Monitor Time 2nd Charge time(min): 0 Wafer cool time(min): 20min Leak rate table Base pressure low Limit(Torr): 1% Base pressure High Limit(Torr): 1% Leak Check check time(s): 60s Leak limit(Torr): 1% Retry Limit(count): 2 Loadlock settings Loadlock configuration O2 analyser model, NGK or Toray: PBI3.1 / PBI4.0 Process L/A Keep value (ppm): 10ppm N2 Flow max (L): 1300L N2 Flow min (L): 300L Ready L/A Keep value (ppm): 10ppm N2 Flow max (L): 1300L N2 Flow min (L): 300L Idle L/A Keep value (ppm): 10ppm N2 Flow max (L): 1300L N2 Flow min (L): 300L L/A O2 limit (ppm): 10ppm.
  • ASM: A400

    ASM A400 Furnace POLYOX (V4 T1); POCL 2 (V4 T2) 2000 vintage.
  • ASM: A 400

    ASM A 400 Vertical Furnace for Al and Nitridation, 8".
  • ASM: A 400

    ASM A 400 Furnace, 8" Process: poly and nitride High temp for both LPCVD tubes: <1000°C Prepared for SMIF All gas panels and MFCs are purged with N2 QTZ is removed 2001 vintage.
  • ASM: A 412

    ASM: A 412 Furnace.
  • ASM: A 400

    ASM A 400 Gate / Poly System, 6" 8" Capable 2002 vintage.
  • ASM: A 400

    ASM A 400 Polymide anneal system, 6" 8" Capable 2008 vintage.
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