21
결과를 찾았습니다
필터
모두 지우기
필터
21 결과가 표시됩니다
웨이퍼 크기
-
(1)
-
(10)
빈티지
-
(10)
-
(1)
-
(2)
-
(1)
-
(1)
-
(17)
원하는 항목을 찾을 수 없습니다?
인기상품
TDK
AFM 15
Flip chip bonders, 8"-12" Chip size range: 300um ~ 5000um Bonding process: Gold-to-gold interconnec
518
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
133
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
239
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
170
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
230
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
168
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Does not include computer Power supply: Voltage: 200 V Frequency: 50
205
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
118
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: 200 V, 3 Phase, 50/60 Hz, 3 Amp
125
인기상품
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
152
