판매용 중고 TDK AFM 15 #9083098

Flip chip packing system, 5", 6", 8" & 12" Mounting tact time: 0.75sec / chip Mounting precision: ± 7μm / 3σ Footprint: 0.99 m2 12" wafer capacity of: Chip (Chip): MAX: 2.5W × 2.5D × 1.0Tmm MIN: 0.3W × 0.3D × 0.1Tmm (Option: Max 7.0W × 7.0Dmm) Substrate (substrate): MAX: 180W × 120D × 3.0Tmm MIN: 50W × 50D × 0.3Tmm (Option: MAX 8 inch Wafer) Mounting tact Time (installation cycle time): 0.8sec / chip (Including 0.2sec process time) Accuracy (accuracy): ± 7μm / 3σ MAX Load (maximum load): 25N (option: 50N, 100N) Chip Supply (chip supply): 5,6,8.12inch wafer etc. Wafer magazine auto loading Standard Features: Pre-heating units Bonds heater table Automatic nozzle cleaning Ultrasonography Bump height measurement collapse Bump-free detection Bad mark detection Wafer Sita axis correction Wafer expansion Hot blow Monitoring the nozzle surface Local area network Nozzle engagement counter Production management data Option and Special Features: Magazine loading / unloading High-efficiency air filter Static eliminator Profile Monitor (USA, load, bump height) Chip Tray Supply Map data (irregularities between the bonding machine, etc.) Bonds nozzle heater Substrate (package) special fixtures Bond test (pre, post) Bonds nozzle polishing jig Ultrasonic horn (for large chip.