판매용 중고 DISCO DFG 8540 #9239485

Wafer grinder, 4"-8" Grinding method: In-feed grinding with wafer rotation Spindle: Type: Air bearing with high frequency motor 2 Axes Output: 4.2 kW Revolution speed: 1000-7000 RPM Z-Axis vertical stroke: 120 mm (With zero point) Z-Axis vertical grinding feed speed: 0.0001-0.08 mm/s Z-Axis vertical fast feed speed: 50 mm/s Minimum Z-Axis vertical movement: 0.1 µm Minimum Z-Axis vertical movement resolution: 0.1 µm Height gauge: Measurement range: 0-1800 µm Resolution: 0.1 µm Repeatability: ±0.5 µm Wafer chuck table: Type: Porous chuck table Chuck method: Vacuum Number of revolutions: 0 - 300 min^-1 (3) Chuck tables Chuck table cleaning Spark out (Chuck table revolutions setting): 0-999 Grinding wheel: Diamond wheel: ø200 mm Wafer handling section / Wafer cleaning section: (2) Cassette storages Cassette flow: Same and open Spinner unit: Water washing and drying Vacuum unit: Discharge speed (m3/h): 29/36 (50/60Hz) Achievable pressure (kPa•G): -90 Water supply temperature 15°C Water supply flow rate: 1 L/min Electric motor: 1.5 kW Water flow rate (L/min): When supplied water temperature > 22°C: 3 When supplied water temperature < 22°C: 1 Grinding accuracy: Thickness variation within one wafer: < 1.5 µm Thickness variation between wafers: < ±3 µm Finish surface roughness: Ry 0.13 µm (with 2000 finish) Ry 0.15 µm (with 1400 finish) Utilities: Air pressure (MPa•G): 0.5 - 0.8 Air flow rate (L/min): 400 ANR Water pressure: 0.3 - 0.4 0.2 - 0.3 0.052 - 0.49 Water flow rate: 25 and 4 Exhaust duct capacity (m3/min): 4 Power supply: 200 VAC ±10%, 3-Phase (50/60Hz) Power consumption: 5.8, 3.3 Maximum power: 19 kVA 2004 vintage.