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인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
356
인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
90
인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
104
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
364
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
374
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
370
인기상품
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
442
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