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인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
335
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인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
74
인기상품
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
95
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
355
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
362
인기상품
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
354
인기상품
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
426
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