판매용 중고 SVG 88-3 #117951
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ID: 117951
웨이퍼 크기: 3"
single cabinet developer system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive
Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
Polyurethane
Silicone
Viton
Automated transfer arm
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windows XP application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 96 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 88-3은 반도체 산업의 고급 리소그래피를 위해 설계된 포토 esist 유형입니다. 세 가지 다른 사진 활성 컴포넌트의 블렌드를 기반으로하는 단일 레이어 저항 (single layer resist) 장비입니다. 사진 활성 컴포넌트의 혼합은 폭넓은 노출 에너지 범위 (exposure energy range) 와 최적의 감도 (optimal sensitivity) 를 제공하여 다밀도 리소그래피 프로세스에 사용할 수 있습니다. 이 시스템은 고해상도 (high-resolution) 기능으로 인해 뛰어난 해상도를 제공하며, 이를 통해 고급 리소그래피 (lithography) 프로세스뿐만 아니라 기본 이미징 레이어로 사용할 수 있습니다. 또한 좋은 기계적 특성을 제공하여 코팅 및 건조 중 변형 위험을 줄입니다. 또한, 저항은 다른 저항보다 전자 빔 흡수 속도가 낮아 전자 빔 노출 시스템 (electron beam exposure system) 과 호환됩니다. 또한 화학적으로 내성이 있으며, 긴 선반 수명을 위해 안정성이 좋습니다. 88-3 저항 장치는 트랜지스터 패턴, 게이트 구조 정의, 금속화 계층, 접촉 구멍 형성 및 상호 연결 라우팅과 같은 광범위한 응용 분야에 적합합니다. 높은 종횡비, 미세 선 (fine line) 정의, 높은 정밀도 정렬이 필요한 프로세스에서 특히 유용합니다. 이 기계는 또한 다양한 광원 구성과 호환되며, 다른 석판 접근 방식에 적합합니다. 이러한 특성 외에도 SVG 88-3 저항 (resist) 도구는 다른 시스템에 비해 결함 밀도가 매우 낮은 "깨끗한 (clean)" 저항 자산으로 잘 알려져 있으므로 뛰어난 결함 성능을 보여줍니다. 또한, 저항의 고해상도 기능은 극도의 정확성이 필요한 프로세스에 이상적입니다. 또한, 저항은 공정 개발을 위해 고온과 호환되며, 청소 공정에 대한 낮은 잔류 수준을 제공합니다. 전체적으로, 88-3은 반도체 산업을 위해 설계된 고급 포토리스 (photoresist) 모델로, 다양한 광원과의 고해상도 기능, 탁월한 결함 성능, 호환성을 제공합니다. 세밀한 선 정의, 높은 종횡비, 높은 정밀도 정렬이 필요한 프로세스에 적합합니다.
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