판매용 중고 SVG 88-3 #117951

SVG 88-3
제조사
SVG
모델
88-3
ID: 117951
웨이퍼 크기: 3"
single cabinet developer system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: Polyurethane Silicone Viton Automated transfer arm Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windows XP application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 96 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 88-3은 반도체 산업의 고급 리소그래피를 위해 설계된 포토 esist 유형입니다. 세 가지 다른 사진 활성 컴포넌트의 블렌드를 기반으로하는 단일 레이어 저항 (single layer resist) 장비입니다. 사진 활성 컴포넌트의 혼합은 폭넓은 노출 에너지 범위 (exposure energy range) 와 최적의 감도 (optimal sensitivity) 를 제공하여 다밀도 리소그래피 프로세스에 사용할 수 있습니다. 이 시스템은 고해상도 (high-resolution) 기능으로 인해 뛰어난 해상도를 제공하며, 이를 통해 고급 리소그래피 (lithography) 프로세스뿐만 아니라 기본 이미징 레이어로 사용할 수 있습니다. 또한 좋은 기계적 특성을 제공하여 코팅 및 건조 중 변형 위험을 줄입니다. 또한, 저항은 다른 저항보다 전자 빔 흡수 속도가 낮아 전자 빔 노출 시스템 (electron beam exposure system) 과 호환됩니다. 또한 화학적으로 내성이 있으며, 긴 선반 수명을 위해 안정성이 좋습니다. 88-3 저항 장치는 트랜지스터 패턴, 게이트 구조 정의, 금속화 계층, 접촉 구멍 형성 및 상호 연결 라우팅과 같은 광범위한 응용 분야에 적합합니다. 높은 종횡비, 미세 선 (fine line) 정의, 높은 정밀도 정렬이 필요한 프로세스에서 특히 유용합니다. 이 기계는 또한 다양한 광원 구성과 호환되며, 다른 석판 접근 방식에 적합합니다. 이러한 특성 외에도 SVG 88-3 저항 (resist) 도구는 다른 시스템에 비해 결함 밀도가 매우 낮은 "깨끗한 (clean)" 저항 자산으로 잘 알려져 있으므로 뛰어난 결함 성능을 보여줍니다. 또한, 저항의 고해상도 기능은 극도의 정확성이 필요한 프로세스에 이상적입니다. 또한, 저항은 공정 개발을 위해 고온과 호환되며, 청소 공정에 대한 낮은 잔류 수준을 제공합니다. 전체적으로, 88-3은 반도체 산업을 위해 설계된 고급 포토리스 (photoresist) 모델로, 다양한 광원과의 고해상도 기능, 탁월한 결함 성능, 호환성을 제공합니다. 세밀한 선 정의, 높은 종횡비, 높은 정밀도 정렬이 필요한 프로세스에 적합합니다.
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