판매용 중고 SVG 88-3 #117942
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ID: 117942
웨이퍼 크기: 3"
single cabinet developer system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, bake, chill, MD develop, bake, chill, with flood expose, receive
Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
Polyurethane
Silicone
Viton
Automated transfer arm
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 108 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 88-3은 SUSS MicroTec의 고급 고해상도 포토 esist 시스템입니다. 광저항제는 반도체 제조에 사용되는 물질의 일종으로, 특정 광파장에 민감하고 화학적으로 반응합니다. 88-3은 네거티브 톤, 딥 UV 타입 포토 esist 시스템으로 기판에 패턴을 만드는 데 사용됩니다. 빛의 패턴에 노출되면, 재료는 반응하여 개발자 용액 (developer solution) 에서 용해도를 변화시킵니다. SVG 88-3은 탁월한 정밀도와 고해상도로 패턴을 재현하도록 설계되었습니다. 일반적으로 사용되는 모든 기판 재료와 호환되며 열, 기계 및 화학 과정에 저항합니다. 88-3은 높은 안정성과 차원 안정성을 유지하면서 2.1 ° m (미크론) 의 작은 선 너비를 재현할 수 있습니다. 또한, 우수한 해상도 및 선 선형성 (linearity) 을 제공하도록 공식화되어 패턴을 높은 수준의 디테일로 정확하게 재생할 수 있습니다. 고급 제형으로 인해 SVG 88-3은 더 나은 광선 투과, 향상된 명암비, 향상된 접착 및 향상된 선반 수명을 제공합니다. 또한 저항 인터페이스 (resist interface) 에서 국부 온도 증가를 줄이기 위해 공식화되어 발열이 개선되고 에칭 결과가 향상됩니다. 88-3은 반도체 장치, MEMS, 디스플레이 및 광전자 응용 프로그램과 같은 수많은 응용 프로그램에 적합합니다. 요약하자면, SVG 88-3은 반도체 제조에서 뛰어난 해상도와 라인 선형성을 제공하도록 설계된 정교한 포토리스 (photoresist) 시스템입니다. 고급 제형은 더 나은 광선 투과, 대조 증가, 접착 개선 및 선반 수명 증가를 제공합니다. 또한, 열, 기계 및 화학 내성이 높은 다양한 기판 재료 (기판 재료) 와의 호환성은 다양한 응용에 적합합니다.
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