판매용 중고 SVG 86-3 #117939

SVG 86-3
제조사
SVG
모델
86-3
ID: 117939
웨이퍼 크기: 3"
single cabinet developer system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, bake, chill, MD develop, bake, chill, with flood expose, receive Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: O-ring belt transfer Polyurethane Silicone Viton Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 108 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 86-3은 반도체 업계의 서브미크론 이미징을 위해 설계된 고해상도, 긍정적 인 저항 시스템입니다. 뛰어난 화학적, 기계적 저항과 높은 상상력을 제공하도록 공식화되었습니다. "베이킹 '이나" 포우스트 베이킹' 을 할 필요 없이 저항 을 적용 하고 무늬 로 만들 수 있다. 86-3은 광산 생성기 (DQN) 와 교차하여 솔 겔을 형성하는 폴리메틸 글루타 리미 드-코-티오 글리콜 산 (PMGTA) 코 폴리머의 감광 화합물로 구성된다. 자외선에 노출 될 때, DQN은 분해되어 PMGTA 폴리머 네트워크를 횡단하는 양성자를 생성한다. 양성자는 저항의 마스크되지 않은 영역과 촉매적으로 반응하여, 용해되지 않는 아미드 연결 구조를 만듭니다. 이것은 노출 된 영역에서 필름의 선택적 탈 패턴 화 (de-patterning) 를 허용하여 패턴 화 된 하드 베이크 저항이 형성된다. 이 시스템의 뛰어난 흐름 및 레벨링 특성은 피처 밀도 (feature-dense) 영역에서도 기판에 대한 좋은 필름 커버리지를 제공합니다. PMGTA 공중합체는 또한 에칭 과정에서 화학 공격 및 기계적 마모에 대한 탁월한 보호를 나타냅니다. 건조 필름 제제 (dry film formulation) 는 또한 액체 저항에 비해 우수한 저장 안정성을 제공하며, 가공 전에 건조나 베이킹이 필요하지 않습니다. PEB (Post Exposure Bake) 단계에서 어닐링 단계를 추가하면 이미지 충실도를 최적화하면서 포토 esist 민감도를 높이고 밀도 높은 이미징에서 패턴 드리프트를 줄일 수 있습니다. 또한, 저항은 습식 에칭 (wet etching), 플라즈마 에칭 (plasma etching) 및 증기 위상 에칭 (vapor phase etching) 을 포함한 다양한 프로세스로 에칭될 수 있으며, 다양한 응용 분야에 매우 다양하고 적합합니다. SVG 86-3은 스택 장치 제작 및 기타 까다로운 리소그래피 응용 프로그램을위한 deep-UV (-388nm) 이미징의 효능이 입증되었습니다.
아직 리뷰가 없습니다