판매용 중고 SVG 86-3 #117939
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ID: 117939
웨이퍼 크기: 3"
single cabinet developer system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, bake, chill, MD develop, bake, chill, with flood expose, receive
Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
O-ring belt transfer
Polyurethane
Silicone
Viton
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 108 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 86-3은 반도체 업계의 서브미크론 이미징을 위해 설계된 고해상도, 긍정적 인 저항 시스템입니다. 뛰어난 화학적, 기계적 저항과 높은 상상력을 제공하도록 공식화되었습니다. "베이킹 '이나" 포우스트 베이킹' 을 할 필요 없이 저항 을 적용 하고 무늬 로 만들 수 있다. 86-3은 광산 생성기 (DQN) 와 교차하여 솔 겔을 형성하는 폴리메틸 글루타 리미 드-코-티오 글리콜 산 (PMGTA) 코 폴리머의 감광 화합물로 구성된다. 자외선에 노출 될 때, DQN은 분해되어 PMGTA 폴리머 네트워크를 횡단하는 양성자를 생성한다. 양성자는 저항의 마스크되지 않은 영역과 촉매적으로 반응하여, 용해되지 않는 아미드 연결 구조를 만듭니다. 이것은 노출 된 영역에서 필름의 선택적 탈 패턴 화 (de-patterning) 를 허용하여 패턴 화 된 하드 베이크 저항이 형성된다. 이 시스템의 뛰어난 흐름 및 레벨링 특성은 피처 밀도 (feature-dense) 영역에서도 기판에 대한 좋은 필름 커버리지를 제공합니다. PMGTA 공중합체는 또한 에칭 과정에서 화학 공격 및 기계적 마모에 대한 탁월한 보호를 나타냅니다. 건조 필름 제제 (dry film formulation) 는 또한 액체 저항에 비해 우수한 저장 안정성을 제공하며, 가공 전에 건조나 베이킹이 필요하지 않습니다. PEB (Post Exposure Bake) 단계에서 어닐링 단계를 추가하면 이미지 충실도를 최적화하면서 포토 esist 민감도를 높이고 밀도 높은 이미징에서 패턴 드리프트를 줄일 수 있습니다. 또한, 저항은 습식 에칭 (wet etching), 플라즈마 에칭 (plasma etching) 및 증기 위상 에칭 (vapor phase etching) 을 포함한 다양한 프로세스로 에칭될 수 있으며, 다양한 응용 분야에 매우 다양하고 적합합니다. SVG 86-3은 스택 장치 제작 및 기타 까다로운 리소그래피 응용 프로그램을위한 deep-UV (-388nm) 이미징의 효능이 입증되었습니다.
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