판매용 중고 DATACON / BESI 2200 Evo #9115929

Die attacher, 8" In-line SMEMA configuration Hard disk upgraded to SSD Spare parts included Equipment module: Dynamic XYZ theta servo motors: yes Theta axis rotary bond-head: yes Programmable lighting systems with RGB light: yes Datacon pattern recognition system with edge, pattern, and ink-dot recognition: Programmable IPU CMOS Substrate camera/optics/illumination: Yes Upward looking camera: Yes Downward looking camera: Yes Wafer camera: Yes Programmable bond force (up to 7000 grams): Yes Bond force sensor and mini-BMC kit: Yes Ionizer: Main axis: Yes Substrate transport system: Current transport system configuration: Heated stage of up to 150 DC temperature Flatboat configuration BETS (Belt Elevation TS) Belt classic transport system: BETS Component presentation system: Wafer lifter and changer: Yes Wafer table with stretcher: Yes Additional frame down-holding application for 8" and 12" wafer: Adaptor for 8" Wafer frame adapter for automatic change: Yes Wafer ring adapter for automatic change: Hoop ring adaptor Waffle pack (Gel pack) holder 2": Waffle pack adaptor Separate gel-pack adaptor Waffle pack (Gel pack) holder 4": Waffle pack adaptor Separate gel-pack adaptor Tape and reel presentation: No SEMS / GEMS Compliant: Capable but not activated Input / Output system: Magazine handler: SMEMA Ready I/O equipment: No Die handling system: Automatic tool changer unit 7-slot: Yes Tool holders and tools: Standard tool holder (shank and tip): Yes Ejector system: Single-chip ejector unit: Yes Upgrade to multi-chip ejection carousel: Yes Eject tool base: Yes Needle kit: No Epoxy application system: Dispenser-pressure/time: Time / Pressure Volumetric pump Epoxy stamping system: Time / Pressure Volumetric pump Auger or positive displacement: Configured based on solar product Flip chip station Automatic tool changer: (7) Slots Die attach Flip chip capability ID Axis Jetter system: Yes Built-in vacuum pump: Disconnected, but available Heated stage (150°C): Yes Vision system with up and down looking cameras Placement accuracy: 10 µm (3 sigma) Programmable bond force (7000 grams) Die pick from wafer, waffle pack, gel pack - Wafer up to 12” with 8" adapter Waffle pack / Gel-Pak® 2” x 2” and 4” x 4” Substrate working range: 8" ID Integrated dispenser for classic transport system Dispenser volumetric screw pump (ID Axis) P-Part for automatic transport system (for ID axis) Calibration tool kit: No 208V/220V Power compatibility: 3Phase - 400V Machine software installation disk: No Integrated dispenser Vision alignment Pick & place head X / Y Placement accuracy: ± 7 μm @ 3s Theta placement accuracy: ± 0.15° @ 3s Die attach: Disconnected Heated bond head and plate Standard bond head: 0° - 360° Rotation Equipment operating and maintenance manual or CD-ROM: Yes CE Marked Currently crated 2008 vintage.