판매용 중고 AMAT / APPLIED MATERIALS ECP SlimCell #9031142

System, 12" Factory interface: 3 FOUP stage Anneal module: Anneal – A SRD module: SRD – B SLIM CELL module: CELL – B, CELL – D IBC module: IBC – B (16) Units: 1. EFEM 2. Buffer Unit 3. Annel Unit 4. Main System 5. Chemical Supplier #1 6. Chemical Supplier #2 7. Chemical Drain Unit 8. Chiller 9. Monitor Stand #1 10. Monitor Stand #2 11. Parts Box #1 12. Parts Box #2 13. Parts Box #3, 14. Parts Box #4 15. Lifter #1 16. Lifter #2 System Configuration: Mainframe: - Wafer Transfer Robot with two Blades x 1 - SLIM CELL TM Module x 2 (Cell - B, Cell - D) - SRD (Spin Rinse Dry) x 1 (SRD - B), - IBC (Integrated Bevel Cleaner) x 1 (IBC - B) - In-Station (Pass Stage) under SRD x 4 - Independent Plating-solution Circulation System x 4 (for Anode and Cathode in each SLIM CELL TM Module) - Mixing Unit for Plating-solution and Cleaning Fluid - Fan Filter Unit (FFU) Factory Interface (FI): - Two Blade Robot - FOUP Stage (ADO) x 3 - Aligner - Fan Filter Unit - GUI Computer controlling FI and Mainframe control systems Heater / Chiller Operator Interface x 2 (Main & Sub) Anneal Chamber Module: - Anneal Chamber x 1 (Anneal - A) - Movement and Temperature Control, Gas Box * Mainframes consist of 1) Mainframe, 2) FI and 5) Anneal Chamber Module * Anneal Chamber is middle of Anneal Chamber Module and Anneal - A is above the Anneal Chamber Mainframe Details: Frame Fan Filter Unit: ULPA Filter (>0.12 μm, >99.999%) Plating-solution Supply Unit SLIM CELLTM Module - Plating Head: 5 RPM to 400 RPM - Plating Cell - Plating-solution circulation system Filter (Millipore, 0.05 μ, 20") Temperature Control ± 1.5 deg C SRD (Spin Rinse Dry): 50 ~ 2500 RPM - Lower Cleaning Nozzle (one for DI and Chemical) - Upper Cleaning Nozzle (one for DI) IBC (Integrated Bevel Cleaner): 50 ~ 2500 RPM ± 20% - Lower Cleaning Nozzle (three for each DI and Chemical) - Upper Cleaning Nozzle (one for each DI and Chemical)I) LBDU (Liquid Blend Dose Unit): ± 5 % AC Box - 208 VAC, 3 Phase, 175 A Mainframe ROBOT - Dual Arm Robot made by Roze, RS-485 (Ethernet) serial interface Factory Interface (FI) Details: FOUP Stage (ADO: Auto Door Opener) - TDK for AMAT Specification Link Tunnel - Dual Blade Robot made by Yaskawa Align Stage detecting Wafer Notch Fan Filter unit: (>0.12 μm, >99.999%) FI / Mainframe Control Unit with UPS (Window NT 4.0) GUI (Graphic-User-Interface) Computer with UPS (Window NT 4.0) Chiller Details - Daiken for AMAT Specification - Temperature Control Range: 5 ~ 22 deg C Operator Interface Details - LCD Touch Panel, Keyboard with Track Ball - Desk Type or Roll-Around or Wall Mount Type Anneal Chamber Module Details: Anneal Chamber - Gas Box: Mixing and Control of N2 96 %, H2 4% Process Gases MFC, Flow Switch - Heater (150 ~ 300 deg C), Cooler Plate, Arm MTBF 1) MTBF Target : 250 hr 2) MTBF Target for each Unit - Slim Cell 3400 hr - IBC 3400 hr - SRD 4000 hr - Anneal 4500 hr - MF Robot 6800 hr - FI 5000 hr.