판매용 중고 CAMTEK Falcon 620 #9090581

Inspection system, 4"-8" Power: 220 V, 1 phase, 16 A Vibration isolation: Comply Proper class: 100 General: Wafer thickness: > 250 um - less application pending Chip size: all possible Max die count per raw: all possible Lens maker (2D/3D): Mitutoyo Wafer handling (robot system): IDE, ISEL Warpage wafer capability: up to 500 microns for 8" wafer System OS: Windows XP Pro SP2 Image storage capacity (hard disk): 120Gb or higher (On/Offline) Control PC: Athlon 2.8 dual processor or dual core Monitor size: 19" Reference die: golden die (cleaned with multiple dice) Map integration: OK Raw data review: Comply (Excel format can be modified by user) Includes defect position and algorithm kinds 2D performance: Detection: foreign material, particles, scratches, embedded, discoloration, not open Repeat-ability: > 97% (contrast 25GL and above) 2D pattern: visual Scan resolution (lateral): 1.8 - 9 um Review resolution: x10 (0.6 um) Min 2D defect: 3.6 um (x5 mag, 1.8 um application pending) Throughput (doc) for 6" (2D): 12 WPH (1.8 um resolution) Critical dimension measurement: Gold bumps and bond pad XY size: shape and positioning violation Accuracy: 1.5 optical pixels (test using built in target) Repeat-ability (sigma): 1 optical pixel (test using built in target) Solder bumps diameter: diameter and positioning violation Accuracy: 1.5 optical pixels (test using built in target) Repeat-ability (sigma): 1 optical pixel (test using built in target) 3D performance: 3D height: bump height, die co-planarity 3D inspection tool: Confocal Chromatic Sensor (CCS) CCS bump height accuracy: +/- 1 um (on target) CCS bump height repeat-ability: 2.0 um at 1 sigma (on target) CCS height measurement range: 1000 um CCS scan resolution (vertical): 0.1 um Main system: Main body: Optical Unit Stage unit Anti-vibration unit Controller unit Cleanroom unit Loading / unloading part: IDE robot Loadport (2 configurable up to 8") General configuration: System control: Windows XP Professional Wafer type: flat and notch - no glass (transparent) Wafer thickness: 250 um - 800 um Cassette stage: independent 2-cassette stage, open cassette type Airborne particle: Class 100 Anti vibration: comply of low band noise AC power connection type: 230V, 50/60Hz System controller: Main PC: Main memory: 2Gb Hard disk drive: 120Gb DVD-RW MCU (Main Computer Unit): 4 PC or 1 Dual core PC - each PC contains dual image processor Display: 19" TFT LCD CCS control unit Stage configuration: Stage: better than 5um flatness Wafer present sensor: vacuum sensor Motion control configuration: Linear motor Stage position accuracy: less than 5 um Position repeat-ability : less than 1 um Stage speed: > 5 um/sec W/F handling configuration: W/F handler: IDE robot system Transfer reliability: > 50,000 wafers Cassette absent & present sensor Wafer ID read function OCR: Top OCR Additional functions: Offline review: OK (real independent offline review) Data output: map, all bump height, raw metrology result SPC: OK OCR: OK (top) Ionizer: OK (1 in main M/C) Particle maintenance: 1 HEPA filter in M/C (1 in Main M/C) Prealigner: OK (ISEL) 3D mapping during review: OK Overkill tolerance: Less than 5 %(at 25 GL contrast) 2007 vintage.