판매용 중고 MUHLBAUER DS 10000 #9203635

Tape and reel die sorter, 12" Smallest footprint: 1200 mm x 1110 mm Signal lights: 3-Color Automatic wafer expander: With heating system for uniform wafer expansion Programmable expansion height: 6 -13 mm Pattern recognition system (PRS): For automatic x and y alignment of wafers Ink dot and chipped corners recognition of chips 2D-Bump inspection Illumination CCD-Camera 16" Monitor Die on fly optic Pick and place bond head: Programmable X / Y / Z table Optical die sensor / Programmable place force: 50 - 200 CN Die collect height adjustment in Z by auto teach function Safety housing Operation panel Optical alignment system for pre-bond tape centering Wafer mapping Wafer thickness: 100 μm to 550 μm Die size (Flip chip): 0.5 x 0.5 mm to 9.0 x 9.0 mm Ink dot size: 100 μm to 350 μm black Bumps Placement precision: X, Y: ± 30 μm CPK 1.33 Y: ±1.5° Wafer changer and lot handler Die size 1.0 x 1.0 mm: Die flip and inspection: Up to 10.000 UPH inch Die size 5.0 x 5.0 mm Die flip and inspection: Up to 6500 UPH inch Input / Output spooler from reel to reel: Input spooler up to 22" reels (Inner diameter 12.5 mm) Output spooling system for 8"-13" reels (Inner diameter 12.5 mm) Output spooling system outside machine housing Automatic wafer changer for 6"-12" magazine Wafer expander change kit, 12"/8": Different wafer frame size: 12" and 8" Network connection: Machine / Map-PC to customers network Flip chip unit: Double die flipping unit Die ejector change kit Mechanical index system for carrier tape: Include 8 mm tape kit Tape width: 8 mm to 24 mm Tapes from reel to reel Inserts for one tape type Insert kit for flexible index system, 12 mm Carrier tape with tape width: 12 mm Suction unit with repair mode Replacement function for flip chips Handling with cutting unit Sealing unit with cover tape spooler: Hot / Cold sealing Sealing tape outer diameter: 200 mm Includes: Hot seal shoe, 8 mm Sealing shoe Vacuum at bond position Additional hot sealing shoe, 12 mm With metal runner Wafer microscope for pick and placing the die Automatic post bond inspection: Die in pocket inspection Empty pocket Tilted die Tombstone Die back side inspection Surface Laser mark Chipping inspection of back side Empty pocket detection: Camera system Vacuum pump: 8 m³/h Capacity Hand barcode reader High resolution camera on wafer inspection: Resolution: 1000 x 1000 Pixel instead of 640 x 480 pixel 2010 vintage.