판매용 중고 ESC Magnum #9225562

Tape and reel machine, 6" Input process materials: Die size / Thickness: 0.18 mm - 12.7 mm x 0.254 mm - 2.54 mm Waffle / Gel packs: X-Y Table handles 2x2" / 4x4" Waffle pack adapter Foton rings: 125 mm - 200 mm Tape input: Single and multi-tape applications Ranging: 15 mm - 60 mm (Wide) Die ejector: Drive system: Dual step eject motion with programmable dwell time Anvil: Vacuum hold down (Tool-less changeover) Ejector: Single / Multiple needle (Tool-less changeover) Output materials: Film frame: Up to 200 mm wafers round / Square array Waffle / Gel packs Manual load / Unload: 2x2" / 4x4" Chip tray adapters JEDEC Trays: Manual load / Unload Tape output: Single and multi-tape applications Range: 15 - 60 mm (Wide) Output process: Work holder: 101.6 mm x 508 mm Programmable pitch: Single pass and multi-pass die placement Wafer table, 8" JEDEC Assembly: Positions and handles JEDEC trays Interface: Monitor: 13” VGA Monitor (Vision display) Programming: 13” Color VGA touch screen operator interface Recipe storage: Minimum 100 recipes on HDD and 3.5” floppy disk COM Port: RS232 Up to 9600 baud SECS I and II, GEM compliant Optical recognition system: Accuracy: +/-1 Pixel Resolution: 256 Grey level at 640 x 480 pixels Capabilities: Pre-pick and place alignment with inked Chipped Edge Inspection tools Post bond inspection tools: Surface analysis and position data Placement accuracy: X/Y Theta: +/- 50µm X/Y, 3° Theta System throughput: Typical cycle rate: 4200 Placements / Hour Facilities: Air: 100 PSI Vacuum: 22” Hg Options: Rotary bond head: Gear driven 0 to 360° Wafer mapping: RS-232 Host link with input and output barcode reader Auto wafer handling: Up to 200 mm wafers mounted on film frames Tape and reel output: Custom design (Single and multi-reel applications) Power: 110/208/220 VAC, Single phase, 15 Amps, 50/60 Hz.