판매용 중고 HENNECKE HE-SIM-02 #9233425

Semi-automatic measuring system For sapphire wafer Thickness range: 200 - 1500 μm Square size substrates: 100 x 50mm: 20,4 sec 130 x 70mm: 28,2 sec Part range: Diameter, 2": < 51.5 mm Diameter, 4": < 102 mm Diameter, 6": < 153 mm Stages: X,Y (High-precision) (2) Chromatic confocal sensors Sensor speed: 200 mm / sec (Standard) Sensor frequency: 4.000 Hz (Standard) Meander pitch: 5mm (Standard) Sample size: 160 mm (Maximum) Thickness, TTV, LTV, sori, bow and warp: X,Y Stage resolution: X, Y = 5 μm Sensor type: Chromatic confocal Sensor resolution: Z = 60 nm Dynamic range (Sensor): 2000 μm (Each side) Accuracy thickness: 200 nm Precision thickness: ± 200 nm Precision TTV: ± 300 nm Accuracy sori, bow, warp: 300 nm Precision sori, bow, warp: ± 300 nm Roughness values: Saw mark: 1 mm Width (Maximum) Waviness: 4 mm Width (Maximum) Saw mark and roughness (Ra and Rz): X, Y Stage resolution: X,Y = 5 μm Sensor type: Chromatic confocal Sensor resolution: Z = 60 nm Dynamic range (Sensor): 2000 μm (Each side) Precision saw mark: ±1200 nm Accuracy saw mark: 300 nm Precision roughness 0.8 μm (Ra and Rz): ±3 % Accuracy roughness (Ra and Rz): 30 nm Central processing unit: Operating system: Windows 7 User interface: (17) Displays Power supply: 230 V, 16 A, 1.5 kW.