판매용 중고 EVG / EV GROUP 620 #9157253

Bond aligner, 6" Wafer thickness 0.1-4.4 mm with total stack of thickness of 4.5 mm Semi automatic loading with mechanical prealignment Quick change of chuck with automatic pressure and vacuum transfer Alignment accuracy: +/- 1 um with high process objectives Alignment stage: Fully motorized X, Y, Theta and Z alignment stage alignment via 3 axis joystick Automatic wedge compensation with air bearing precision stage WEC contact force from 1-30 N adjustable, no shift between wafers DC Motor controllers for cursor key fine alignment Bottom side microscope, MS241: Motorized split-field microscopes for alignment in visible light with CCD cameras Bottom side alignment via digitized alignment keys (mask) or crosshair Travel range: X: 30-100 mm, Y: +/- 12 mm CCD Camera (604 x 575 pixels) (2) 20x Objectives (2) 10x Objectives for flat and chip alignment: Minimum distance (optical axis) of 8 mm Suitable for top or bottom side microscope Bond tool 20 mm x 20 mm universal (set): For thermo compression bonding process Bond chuck with mechanical clamping Loading chuck Bond glass Stainless steel pressure insert included in 4" tooling Stainless steel pressure disc Bond tool 70 mm x 70 mm universal (set): For thermo compression bonding process Bond chuck with mechanical clamping Loading chuck Bond glass Stainless steel pressure insert included in 4" tooling Stainless steel pressure disc Bond tool 4" universal (set): For anodic and thermo compression bonding process Bond chuck with mechanical clamping Loading chuck Bond glass With electrode and glass pressure insert Stainless steel pressure insert for TCB Separation flags Stainless steel pressure disc for TCB Bond tool 6" universal (set): For anodic and thermo compression bonding process Bond chuck with mechanical clamping Loading chuck Direct wafer clamping With electrode (glass pressure insert included in 4" tooling) Separation flags Stainless steel pressure disco for TCB Loading chuck 4" for wafer and shadow masks: For loading and alignment For autoloading with through holes Recess for clamps Remains on EVG 620 shadow mask aligner Chuck frame 4" for wafer and shadow mask: For fixing insert Recess for clamps Supports the insert to hold the alignment stack Remains on EVG 620 shadow mask aligner Shadow mask / wafer holder with 4" clamps: For clamping substrates Includes: clamps used to carry aligned Clamped stack to further processing 2003 vintage.