판매용 중고 SHIBAURA TFC-2000C #9379876

Flip chip bonders Dispense unit Pulse heat system Operating system: Windows-NT Main body: Bonding head tool (X, Y, Z Theta) Clump Flip unit: Colette Tape transfer unit: Roller transfer Bond stage unit: X, Y, Z Table Wafer supply unit: Wafer cassette elevator Wafer supply XY table Die eject unit Tape / Die recognition X, Y, Z table Recognition: Recognition controller Tape / Die recognition camera Wafer recognition camera Color monitor Controller Color touch panel MO Driver Accessory: Standard tools (Wrench, spanner, screw driver, pair of pincers, etc) Features: High productivity: 2.5 Sec / die High alignment accuracy: 5.0 um Wafer, die recognition: Die recognition form: Gray scale vision system CCD Camera, 1/2" Wafer recognition: Optic: Manual zoom type optics with half mirror Magnification: 10x (0.2 - 2) Die inspection: Position Bad mark Chipping inspection Alignment: Theta correction: Under +/- 2° (First die alignment function) Dispensing area: X: Less than 20 PF Y: +/- 30 mm MUSASHI ENGINEERING / SIGMA MX-9000SM2 Controller Heating stage (Vacuum + clamp holder) Room temperature: -150° EFD Syringe: 10 cc Spare parts: Filter element Fuse (2) Illumination lamps for APS (2) Thermocouples Flip unit nozzle 2003 vintage.