판매용 중고 ESC Magnum #9225561

Die sorter, 8" Input process materials: Die size / Thickness: 0.18 - 12.7 mm x 0.254 - 2.54 mm Waffle / Gel packs: X-Y Table handles 2x2" / 4x4" Waffle pack adapter Tape input: Single & multi-tape Applications ranging: 15 mm - 60 mm (Wide) Foton rings: 125 mm - 200 mm Die ejector: Drive system: Dual step eject motion with programmable dwell time Anvil: Vacuum hold down (Tool-less changeover) Ejector: Single / Multiple needle (Tool-less changeover) Output materials: Film frame: Up to 200 mm wafers round / Square array Waffle / Gel packs Manual load / Unload: 2x2" / 4x4" Chip tray adapters JEDEC Trays: Manual load / Unload Tape output: Single & multi-tape Applications ranging: 15 - 60 mm (Wide) Output process: Work holder: 101.6 mm x 508 mm Programmable pitch: Single pass & multi-pass die placement Wafer table: Capable of processing: Up to 200 mm wafers JEDEC Assembly: Positions & handles JEDEC trays Interface: Monitor: 13” VGA Monitor (Vision display) Programming: 13” Color VGA touch screen operator interface Recipe storage: Minimum 100 recipes on HDD & 3.5” floppy disk COM Port: RS232 Up to 9600 baud SECS I & II, GEM compliant Optical recognition system: Accuracy: +/-1 Pixel Resolution: 256 Grey level at 640 x 480 pixels Capabilities: Pre-pick & place alignment with inked Chipped Edge Inspection tools Post bond inspection tools: Surface analysis & position data Placement accuracy: X / Y Theta: +/- 50µm X / Y, 3° Theta System throughput: Typical cycle rate: 4200 Placements / Hour Facilities: Air: 100 PSI Vacuum: 22” Hg Options: Rotary bond head: Gear driven 0 - 360° Wafer mapping: RS-232 Host link with input & output bar code reader Auto wafer handling: Up to 200 mm wafers mounted on film frames Tape & reel output: Custom design (Single & multi-reel applications) Power: 110/208/220 VAC, Single phase, 15 amps, 50/60 Hz.