판매용 중고 EVG / EV GROUP Gemini #9229293

Automated wafer bonding system, 8" Substrate handling module: Between alignment stage and load cassette Loading / Unloading: 4-Axis industrial robot With external optical prealigner Wafer handling: End effector for robot unit With vacuum from bottom side Bond chuck handling module: Between alignment station and bond chamber Automated operation of up to (4) bond modules Unclamp station with handshake to linear transfer station Cassette station: Present sensor Empty sensor Graphical user interface for manual and fully automated operation Independent sequence Monitoring Data storage Wafer ID reader: SEMI T1 (Barcode) SEMI M12, SEMI M13 (Both alphanumeric) SEMI T7 (Data matrix code) High resolution alignment stage with DC servomotors in X, Y and Θ Top and bottom wafer chuck with position measurement system Fully motorized split field microscope for double side viewing High resolution digital CCD cameras Integrated magnification unit: 1x - 3x Alignment with split field microscope Objective: 5x Loading chuck, 4"-6" Bond module: Universal bond chamber with top and bottom side heaters Flag pulling mechanism Up to 550°C and 3.5 kN Atmospheric capabilities down to 1 x 10^-3 mbar (7.5 x 10^-4 Torr) Pressure: 3 bar abs. Connections for evacuation, purge and vent Independent temperature controllers for top and bottom side of each chamber Electronic pressure regulator for controlled contact force Pneumatic wafer bow pin: For most accurate alignment of separated wafers Spring-loaded pin in bond chamber Rapid cooling for top and bottom side heater: For symmetric top / Bottom side cooling at identical Forced water cooling Silent operation Programmable cooling rate Increased piston force: Up to 10 kN (2250 lbf) Resolution: 3 N steps Pressure disk, 4"-6" Universal bond chuck, 4"-6" For anodic, thermo compresion and eutetic bonding process Bond chuck with mechanical wafer direct clamping Bond chuck out of titanium Vacuum equipment with bypass system: Pump time: < 2min from 1000 to 1 x 10^-3 mbar Gas backfill time: < 10sec from high vacuum to 1 bar Purge connections for process gas Pump down time: From ambient to 2 mbar abs. pressure < 60s Vacuum controller: 1 - 1000 mbar Resolution: 1 mbar Accuracy +/-0, 5% / +/-3 mbar With piezo gauge and control valve Minimum controllable pressure: 1mbar abs Hardware: SEMI-E4: Semi Equipment Communication Standard (SECS-1) Message transfer: Hardware interface RS232 SEMI E37: High speed Secs Message Service (HSMS) Generic services Hardware interface: Ethernet TCP/IP Tooling with system: Bond chucks with graphite: 9 x 6” Graphite pressure disks: 4 x 6” Objective: Bottom and top alignment With standard 5x objectives with red LED Second N2 line is installed in each module Controlled with needle and bypass valves Includes: Chiller (4) Vacuum pumps (4) Turbo pumps are installed in chambers Operating system: MS-Windows 2013 vintage.